Developing levels of protection against electronic process breakdowns starts off in which most forget—right before components get to your assembly line.
Primary continuity checks can’t detect intermittent connections or substance degradation. We Blend automated optical inspection with curve tracing to recognize 98.6% of latent defects in resistors and diodes right before cargo.
Automotive engineers reduced guarantee statements by 52% just after addressing thermal pressure in control modules. Our scenario scientific studies expose how vibration designs cracked solder joints in motor ECUs—a correct requiring specialised mounting and conformal coatings.
Assembly flaws undermine even sturdy types. Cold solder joints crack beneath thermal cycling, whilst misaligned connectors produce intermittent faults. We not too long ago traced 41% of warranty promises in IoT equipment to insufficient flux cleansing through PCB assembly.
Radiography: Using X-rays or other types of radiation to examine The interior construction on the component.
Immediately after our investigation is done, we existing an entire report back to our clients and our excellent devices be sure that all examination outcomes are exact and verifiable.
Screening Assessing how your services fulfill and exceed quality, safety, sustainability and overall performance requirements.
Derating procedures—operating areas at sixty% potential—extended industrial robot lifespans by 41% in our trials. We aid engineers decide on products that withstand particular environmental stresses, like salt spray in marine electronics.
The ATS Spouse and children of Corporations (FoC) delivers its analysis capabilities to uncover the reason for failures in a variety of components. Regardless if you are investigating an individual component or coping with an entire technique failure, you could trust in the ATS failure analysis group’s know-how and in-depth knowledge of the product or service’s application as well as appropriate testing here tactics to meet your whole failure analysis wants.
A: Widespread will cause of component failure include things like substance defects and flaws, design and manufacturing mistakes, and operational and environmental variables.
Scanning electron microscopy (SEM): Utilizing a concentrated beam of electrons to examine the area topography from the component.
Our prosperity of means, created and shared by our global community of industry experts, can help ensure that both you and your organisation have usage of up-to-day know-how, ideal practises and education and learning.
Enhanced security: By pinpointing and addressing prospective failure modes, engineers can Increase the safety of apparatus and systems.
From this angle, failure analysis is not only a technical issue but can be linked to law and justice.